BMP180 is meant to be used inside of case of KIT-2159. Placing them (BMP and SHT) inside external case is possible for kit to solder:
NAM (KIT-2159) is soldered with SHT31 and BMP180 on two cables, we wasn’t sure company doing soldering will do it properly when we sent kits to solder to them, so we have chosen safe version - SHT31 inside external housing and BMP180, just for pressure inside case. This is why it is inside shrink tube, to prevent anty shorts.
With next firmware release there will be checkbox for BMP180 inside case. When enabled it won’t send any temperature from BMP180 to APIs.